| Production Line PLC |
Emergency Stop Active |
Emergency-stop button pressed, safety relay open, or safety circuit wiring interrupted. |
Check the HMI alarm history and inspect the emergency-stop circuit visually. Do not bypass the safety relay. Reset only after confirming that personnel and equipment are clear. |
Safety circuit should show a closed and healthy status after all emergency-stop devices are released. |
Identify the activated device, release it if safe, inspect connectors and safety relays, then perform a controlled reset. |
High |
| Glass Loading |
Glass Position Error |
Misaligned glass, failed photoelectric sensor, dirty reflector, or incorrect conveyor timing. |
Stop the line using the normal stop function. Inspect sensor lenses, glass position, guides, and conveyor movement. Apply lockout/tagout before reaching into the machine. |
Glass should remain within the equipment's specified positioning tolerance; the exact value depends on the line design and product format. |
Clean and align sensors, remove broken glass using approved tools, verify guide settings, and run a single-piece test. |
High |
| Cell Stringing |
Soldering Temperature Low |
Heater degradation, thermocouple fault, incorrect recipe, poor thermal contact, or insufficient warm-up time. |
Compare the controller reading with an independent calibrated temperature instrument. Perform verification only by trained personnel and follow the equipment's hot-surface controls. |
Typical soldering setpoints are commonly around 300–360 °C, but the approved value depends on ribbon, solder, flux, cell, and process qualification. |
Check the recipe, heater output, thermocouple connection, and warm-up time. Requalify the process after any temperature change. |
High |
| Cell Stringing |
Ribbon Soldering Open or Weak Joint |
Insufficient heat, excessive line speed, contaminated ribbon, poor flux application, or incorrect ribbon alignment. |
Inspect sample joints under magnification and compare pull-test or peel-test results with the approved process specification. Do not handle hot strings without thermal protection. |
Joint appearance should be continuous and free from visible voids, lifted ribbon, excessive solder balls, or cell cracks. |
Check solder profile, ribbon cleanliness, flux quantity, alignment, and pressure. Hold affected material until inspection is complete. |
High |
| Layup Station |
EVA or Encapsulant Misalignment |
Incorrect material width, roll tracking error, vacuum loss, feeder timing error, or product recipe mismatch. |
Verify the active recipe against the work order. Inspect web tracking and vacuum readings without placing hands inside the station. |
Encapsulant overlap and edge clearance must remain within the approved process specification for the module design. |
Correct the material roll position, repair leaks, verify feeder timing, and inspect the first articles after adjustment. |
Medium |
| Vacuum Laminator |
Vacuum Not Reached |
Door seal leakage, vacuum pump problem, clogged filter, valve failure, or trapped air path. |
Confirm the chamber is closed and guards are engaged. Review the pressure trend, inspect the door seal, and use an approved leak-test procedure. |
Many laminators operate with a vacuum setpoint near 0.5–2.0 kPa absolute, but the validated recipe is the controlling reference. |
Inspect seals and valves, clean or replace filters, check pump oil or pump condition, and repeat the leak test before production. |
High |
| Vacuum Laminator |
Lamination Temperature Deviation |
Heater-zone failure, inaccurate temperature sensor, airflow problem, or incorrect recipe selection. |
Compare displayed temperatures with a calibrated data logger or surface probe at designated test points. Avoid contact with hot surfaces. |
Common lamination recipes use approximately 140–160 °C, with cycle times often around 10–20 minutes; validated product parameters take priority. |
Check heater zones, sensors, recipe selection, and uniformity. Quarantine modules produced outside the validated process window. |
High |
| EL Inspection |
Dark Cell Area or Broken Cell Indication |
Cell crack, poor solder connection, inactive cell area, insufficient current injection, or camera exposure error. |
Confirm test current, exposure settings, and image focus. Use the approved electrical isolation procedure before opening the inspection enclosure. |
EL images should be compared with an approved reference library. Any electrically significant crack or inactive area requires engineering disposition. |
Separate the module, repeat the test, inspect solder joints and cell handling, and record the defect location for traceability. |
High |
| Framing and Curing |
Frame Adhesive or Sealant Incomplete |
Incorrect bead size, nozzle blockage, expired material, poor surface preparation, or insufficient curing time. |
Inspect bead continuity and width using a non-contact method where possible. Verify material batch, storage condition, and expiration date. |
Adhesive bead dimensions and curing time must follow the qualified process specification; incomplete coverage is not acceptable. |
Clean the nozzle, verify dispensing pressure and speed, replace unsuitable material, and repeat the inspection after curing. |
Medium |
| Junction Box |
Junction Box Bonding Failure |
Contaminated backsheet, insufficient adhesive, incorrect placement pressure, or bonding surface damage. |
Check position and coverage visually. Perform adhesion or pull testing only under the approved test method and after the specified cure time. |
Bonding strength and position must meet the qualified product specification; visual contact alone does not confirm bond strength. |
Improve surface cleaning, verify adhesive quantity and placement force, and hold modules until bond strength is confirmed. |
High |
| Electrical Test |
Insulation Resistance Low |
Moisture ingress, damaged cable, pinched insulation, contaminated surface, or junction-box sealing defect. |
Disconnect the module from all external circuits. Apply lockout/tagout, discharge capacitors, and use a properly rated insulation tester operated by qualified personnel. |
Acceptance limits depend on module rating and the applicable test standard; a commonly used screening value is above 40 MΩ·m², subject to the approved test method. |
Dry and clean the module, inspect cables and junction box, repeat the test, and reject or repair only according to the qualified procedure. |
High |
| Electrical Test |
Ground Continuity Failure |
Loose grounding connection, damaged frame path, oxidation, broken conductor, or incorrect test fixture contact. |
Verify test-fixture contact first, then use a low-resistance continuity tester with the module isolated from all live sources. |
Protective bonding resistance is normally required to be very low; the approved product specification and applicable safety standard determine the exact limit. |
Clean contact points, tighten or replace hardware, repair the bonding path, and repeat the test with recorded results. |
High |
| Flash or IV Testing |
Power Output Below Limit |
Cell mismatch, soldering defect, optical contamination, incorrect irradiance calibration, temperature error, or measurement instability. |
Verify irradiance, module temperature, reference device calibration, electrical connections, and test recipe before opening the module for investigation. |
Reference conditions are commonly 1,000 W/m² irradiance and 25 °C cell temperature. Output tolerance is defined by the product specification. |
Repeat the test after stabilizing conditions, compare the IV curve with known-good samples, and route persistent failures to process engineering. |
Medium |
| Conveyor and Servo Drive |
Servo Overload or Position Following Error |
Mechanical obstruction, excessive load, incorrect acceleration, coupling misalignment, or encoder feedback problem. |
Stop the equipment and isolate power before removing obstructions or accessing moving parts. Review drive diagnostics after the axis is in a safe state. |
Motor current should remain within the rated operating range; repeated peaks indicate a mechanical or tuning issue. |
Inspect bearings, belts, guides, couplings, and payload. Confirm motion parameters and perform a controlled homing sequence. |
High |
| Compressed Air System |
Low Air Pressure |
Compressor capacity problem, leaking tubing, closed valve, blocked filter, or excessive simultaneous demand. |
Read the pressure gauge from a safe location and inspect visible tubing. Depressurize the system before disconnecting pneumatic components. |
Many automated PV lines use approximately 0.5–0.7 MPa, but each machine's pneumatic specification is controlling. |
Repair leaks, replace clogged filters, open the correct supply valve, and verify pressure recovery under operating load. |
High |
| Traceability System |
Barcode or Serial Number Read Failure |
Dirty lens, damaged label, poor lighting, incorrect scanner focus, network interruption, or duplicate serial number. |
Check the scanner status and sample label without bypassing traceability controls. Confirm the serial number against the manufacturing execution record. |
Each finished module should have one unique, readable identifier linked to its process and test records. |
Clean the scanner, correct lighting or focus, reprint the label when authorized, and quarantine products with uncertain identity. |
Medium |
| Safety and Maintenance |
Repeated Alarm After Reset |
Intermittent sensor, loose terminal, failing actuator, software-state conflict, or an unresolved mechanical fault. |
Do not repeatedly reset the machine. Record the alarm code, timestamp, operating conditions, and preceding actions; then escalate to qualified maintenance personnel. |
Three or more repeated occurrences in one shift should normally trigger documented maintenance review, subject to site procedures. |
Analyze alarm history, inspect connections and components, test under controlled conditions, and document the verified root cause. |
High |